The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
Dec. 15, 2014
Applicant:
Nikka Seiko Co., Ltd., Setagaya-ku, Tokyo, JP;
Inventors:
Masaaki Shinjo, Tokyo, JP;
Yoshimasa Takeuchi, Tokyo, JP;
Tsuyoshi Tadano, Tokyo, JP;
Masafumi Hirose, Tokyo, JP;
Assignee:
NIKKA SEIKO CO., LTD., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/29 (2006.01); B23K 26/00 (2014.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/009 (2013.01); B23K 26/364 (2015.10); B23K 2201/40 (2013.01); B23K 2203/56 (2015.10); H01L 2924/0002 (2013.01);
Abstract
A protective film material for protecting a surface of a wafer during a laser processing treatment contains a water soluble poly-N-vinyl acetamide. The protective film material is applied to the surface of the wafer which is then irradiated with a laser beam through the protective film material to perform a laser processing treatment. After the laser processing treatment, the protective film material is removed by washing with water.