Tokyo, Japan

Tsuyoshi Shiratori

This inventor holds 1 USPTO granted patent. Top assignee: Asahi Kasei Emd Corporation. Active years: 2010.


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Tsuyoshi Shiratori: Innovator in Conductive Filler Technology

Introduction

Tsuyoshi Shiratori is a prominent inventor based in Tokyo, Japan. He is known for his innovative contributions to the field of conductive materials. His work focuses on developing advanced fillers that enhance the performance of electronic components.

Latest Patents

Shiratori holds a patent for a conductive filler that can be fusion-bonded at lower temperature conditions than traditional methods. This filler is particularly useful for heat-resistant applications similar to those of the Sn-37Pb eutectic solder. The patent describes a mixture of first metal particles composed of an alloy with specific percentages of silver, bismuth, copper, indium, and tin. Additionally, it includes second metal particles with a different alloy composition. This innovative approach allows for improved manufacturing processes in electronics.

Career Highlights

Tsuyoshi Shiratori is currently employed at Asahi Kasei Emd Corporation, where he continues to push the boundaries of conductive material technology. His expertise and dedication have made significant impacts in the industry. He has been recognized for his innovative solutions that address the challenges faced in electronic manufacturing.

Collaborations

Shiratori collaborates with fellow inventor Norihito Tanaka, working together to advance their research and development efforts. Their partnership has led to the exploration of new materials and techniques in the field of conductive fillers.

Conclusion

Tsuyoshi Shiratori's contributions to conductive filler technology exemplify the spirit of innovation in the electronics industry. His work not only enhances product performance but also paves the way for future advancements in material science.

Profile summary based on public USPTO records.
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