The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2010
Filed:
Jun. 26, 2007
Norihito Tanaka, Tokyo, JP;
Tsuyoshi Shiratori, Tokyo, JP;
Norihito Tanaka, Tokyo, JP;
Tsuyoshi Shiratori, Tokyo, JP;
Asahi Kasei EMD Corporation, Tokyo, JP;
Abstract
Disclosed is a conductive filler which can be fusion-bonded under lower temperature conditions (with the peak temperature of not less than 181° C.) than the reflow heat treatment conditions for an Sn-37Pb eutectic solder. This conductive filler is applicable to heat-resistant uses similar to those of the Sn-37Pb eutectic solder. The conductive filler is a mixture of first metal particles composed of an alloy having a chemical composition including 25-40% by mass of Ag, 2-8% by mass of Bi, 5-15% by mass of Cu, 2-8% by mass of In and 29-66% by mass of Sn, and second metal particles composed of an alloy having a chemical composition including 5-20% by mass of Ag, 10-20% by mass of Bi, 1-15% by mass of Cu and 50-80% by mass of Sn. In the mixture, 20-10,000 parts by mass of the second metal particles are contained per 100 parts by mass of the first metal particles.