Fujisawa, Japan

Tsutomu Yamaoka

This inventor holds 1 USPTO granted patent. Top assignee: Maruwa Corporation. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsutomu Yamaoka. Retrieved from https://idiyas.com/inventor/tsutomu-yamaoka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Tsutomu Yamaoka

Introduction

Tsutomu Yamaoka is a notable inventor based in Fujisawa, Japan. He has made significant contributions to the field of electronics, particularly in the manufacturing of printed wiring boards. His innovative methods have paved the way for advancements in circuit design and production.

Latest Patents

Yamaoka holds a patent for a printed wiring board manufacturing method. This method involves attaching a copper foil to both sides of an insulating material to create a substrate. A large number of through-holes are then made in the substrate, and the insides of these through-holes are made electrically conductive. After coating one side of the substrate with a photosensitive dry film, a developing solution infiltrates the through-holes to develop the film as a plating resist. The film is then exposed to harden, and the outer masking layer is removed to allow for copper electroplating inside the through-holes. Finally, the photosensitive dry film is removed to reveal a circuit pattern.

Career Highlights

Yamaoka is associated with Maruwa Corporation, where he has applied his expertise in electronics and manufacturing. His work has contributed to the company's reputation for quality and innovation in the industry.

Conclusion

Tsutomu Yamaoka's inventive methods in printed wiring board manufacturing demonstrate his significant impact on the electronics field. His contributions continue to influence the design and production of circuit boards today.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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