The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2008
Filed:
Oct. 03, 2005
Tsutomu Yamaoka, Fujisawa, JP;
Tsutomu Yamaoka, Fujisawa, JP;
Maruwa Corporation, Fujisawa, JP;
Abstract
According to this manufacturing method, a copper foil is attached to both sides of an insulating material to form a substrate. First, a large number of through-holes is made in the substrate and the inside of the through-holes is made electrically conductive. Then, after one side of the substrate is coated with a photosensitive dry film having an outer masking layer attached thereto, a developing solution is caused to infiltrate into the through-bores from the other side to develop the photosensitive dry film as a plating resist. The photosensitive dry film is then exposed to be hardened. The outer masking layer is removed to copper-electroplate the inside of the through-holes and the like. Finally, the photosensitive dry film is removed to form a circuit pattern.