Company Filing History:
Years Active: 2017
Title: Tsutomu Masuko: Innovator in Underfill Composition Technology
Introduction
Tsutomu Masuko is a notable inventor based in Niigata, Japan. He has made significant contributions to the field of materials science, particularly in the development of underfill compositions used in electronic packaging.
Latest Patents
Masuko holds a patent for an underfill composition designed for encapsulating a bond line. This innovative composition is characterized by its fluidity, which remains less than about ten minutes over a two-centimeter distance at a temperature of approximately 90 degrees Celsius. Additionally, it maintains a bond line thickness of about 50 microns or less while achieving a bulk thermal conductivity greater than about 0.8 W/mK in its cured state.
Career Highlights
Tsutomu Masuko is associated with Namics Corporation, where he has been instrumental in advancing the company's research and development efforts. His work focuses on enhancing the performance and reliability of electronic components through innovative material solutions.
Collaborations
Masuko collaborates with talented professionals in his field, including Pawel Czubarow and Toshiyuki Sato. Their combined expertise contributes to the ongoing success of their projects and innovations.
Conclusion
Tsutomu Masuko's contributions to underfill composition technology exemplify the importance of innovation in the electronics industry. His work continues to influence the development of advanced materials that enhance the performance of electronic devices.