The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Mar. 04, 2014
Applicant:
Namics Corporation, Niigata-shi, Niigata, JP;
Inventors:
Assignee:
NAMICS CORPORATION, Niigata, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/04 (2006.01); C08K 3/28 (2006.01); C08L 63/00 (2006.01); C09D 163/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); C08K 3/22 (2006.01); C08K 3/38 (2006.01); H01L 25/065 (2006.01); C08K 3/34 (2006.01); C08G 59/50 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 59/5033 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/34 (2013.01); C08K 3/38 (2013.01); C08L 63/00 (2013.01); H01L 23/295 (2013.01); H01L 24/29 (2013.01); H01L 25/0652 (2013.01); C08K 2003/282 (2013.01); C08K 2201/003 (2013.01); H01L 21/563 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29391 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/182 (2013.01);
Abstract
An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.