Tsung-Te Chiu

Title: Tsung-Te Chiu: Innovator in Semiconductor Technology

Introduction

Tsung-Te Chiu is a prominent inventor based in Fujian, China. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on the development of advanced semiconductor devices and manufacturing methods.

Latest Patents

Chiu's latest patents include a "Backside Metallized Compound Semiconductor Device and Method for Manufacturing the Same." This invention features a compound semiconductor wafer with a metal layered structure. The device includes a substrate with front and back surfaces, along with a ground pad structure on the front surface. A via extends from the back to the front surface, exposing a side wall of the substrate and a portion of the ground pad structure. The metal layered structure on the back surface covers the side wall and the ground pad structure, consisting of an adhesion layer, a seed layer, a gold layer, and an electroplated copper layer. Additionally, he has developed a "Method for Manufacturing Backside Metalized Compound Semiconductor Wafer," which outlines the steps for creating a backside metalized compound semiconductor wafer, including the formation of various layers on the back surface.

Career Highlights

Tsung-Te Chiu is currently associated with Xiamen Sanan Integrated Circuit Co., Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of compound semiconductor devices.

Collaborations

Chiu has collaborated with notable colleagues, including Houng-Chi Wei and Bing-Han Chuang, contributing to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Tsung-Te Chiu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor manufacturing and device design.