Tsung-Kuan A Chou

Title: Innovations of Tsung-Kuan A Chou in MEMS Technology

Introduction

Tsung-Kuan A Chou is a notable inventor based in Ann Arbor, MI (US). He has made significant contributions to the field of microelectromechanical systems (MEMS). His innovative work focuses on low-temperature patterned wafer bonding techniques, which are crucial for advancing MEMS technology.

Latest Patents

Tsung-Kuan A Chou holds a patent for a method titled "Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS structure fabrication." This patent describes a process for low-temperature (150-300° C.) patterned wafer bonding of complex 3D MEMS. The method involves providing a first pre-processed wafer and a second pre-processed wafer. A photosensitive benzocyclobutene (BCB) polymer is applied to the first surface of the first wafer in a predetermined pattern to define a bonding layer. The second wafer is then bonded to the first wafer only along this bonding layer.

Career Highlights

Tsung-Kuan A Chou is affiliated with the University of Michigan, where he continues to push the boundaries of MEMS technology. His work has garnered attention for its innovative approach to wafer bonding, which is essential for the fabrication of advanced MEMS devices.

Collaborations

He has collaborated with notable colleagues, including Khalil Najafi and Luis P Bernal, who share his passion for advancing technology in the field of MEMS.

Conclusion

Tsung-Kuan A Chou's contributions to low-temperature wafer bonding and MEMS fabrication highlight his role as an influential inventor in the field. His innovative methods pave the way for future advancements in microelectromechanical systems.