The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Jun. 05, 2002
Tsung-kuan A. Chou, Ann Arbor, MI (US);
Khalil Najafi, Ann Arbor, MI (US);
Luis P. Bernal, Ann Arbor, MI (US);
Peter D. Washabaugh, Ann Arbor, MI (US);
Tsung-Kuan A. Chou, Ann Arbor, MI (US);
Khalil Najafi, Ann Arbor, MI (US);
Luis P. Bernal, Ann Arbor, MI (US);
Peter D. Washabaugh, Ann Arbor, MI (US);
The Regents of the University of Michigan, Ann Arbor, MI (US);
Abstract
A method of low-temperature (150-300° C.) patterned wafer bonding of complex 3D MEMS comprising providing a first pre-processed wafer having a first surface and a second pre-processed wafer having a second surface. Photosensitive benzocyclobutene (BCB) polymer is then applied to the first surface of the first wafer in a predetermined pattern to define a bonding layer. The second wafer is then bonded to the first wafer only along the bonding layer.