Tsung-Ju Yang

Title: Tsung-Ju Yang: Innovator in Bonding Pad Technology

Introduction

Tsung-Ju Yang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the design and manufacturing of bonding pads. With a total of 3 patents to his name, Yang's work has had a notable impact on the industry.

Latest Patents

One of Yang's latest patents is focused on a bonding pad that features low parasitic capacitance. This innovative design minimizes stress transmission to the underlying metal layer during the bonding process. A key aspect of this invention is that the damascene wiring directly beneath the bonding pad is limited to its outer edges, forming a hollow square shape. This design restricts the overlap of the aluminum pad with the via hole area only. After applying a passivation layer with suitable diffusion barriers, the structure is over-filled with a soft metal, typically copper or its alloys, and then planarized. A via hole is subsequently formed to communicate with the damascene wiring, which can take the shape of a smaller hollow square or consist of individual vias arranged in a broken hollow square pattern.

Career Highlights

Tsung-Ju Yang is affiliated with the Industrial Technology Research Institute, where he continues to advance his research and development efforts. His work has been instrumental in enhancing the performance and reliability of semiconductor devices.

Collaborations

Yang has collaborated with notable colleagues, including Chin Chiu Hsia and Bing-Yue Tsui, contributing to a dynamic research environment that fosters innovation.

Conclusion

Tsung-Ju Yang's contributions to bonding pad technology exemplify his commitment to advancing semiconductor manufacturing processes. His innovative designs and collaborative efforts continue to shape the future of the industry.