Tsung-Hung Wu

Title: Tsung-Hung Wu: Innovator in Module Assembly Tolerances

Introduction

Tsung-Hung Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of engineering, particularly in the area of module assembly. His innovative approach addresses the challenges associated with tolerances in assembling modules.

Latest Patents

Tsung-Hung Wu holds a patent for a "Method and structure for compensating tolerances in assembling modules." This patent outlines a method that applies to a pressing fixture and a module with a baseline reference plane and an assembly baseline plane. The assembly baseline plane features at least three compensation baseline bumps, which have a height greater than the compensation amount. The method involves adjusting the position of the module or the pressing fixture to ensure that the baseline reference plane is parallel to the calibration reference plane. The pressing fixture then uses the calibration reference plane to press on the compensation baseline bumps, altering the position of the bump tops. After removing the pressing fixture, the bump tops form a preliminary baseline plane that is parallel to the baseline reference plane.

Career Highlights

Tsung-Hung Wu is currently employed at Topray MEMS Inc., where he continues to develop innovative solutions in his field. His work has garnered attention for its practical applications and effectiveness in improving assembly processes.

Collaborations

He has collaborated with notable colleagues, including Chin-Sung Liu and Shin-Ter Tsai, contributing to advancements in their shared field of expertise.

Conclusion

Tsung-Hung Wu's contributions to the engineering sector, particularly through his patent on module assembly tolerances, highlight his innovative spirit and dedication to improving manufacturing processes. His work at Topray MEMS Inc. and collaborations with esteemed colleagues further emphasize his impact in the industry.