The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 2021

Filed:

Feb. 03, 2020
Applicant:

Topray Mems Inc., Hsinchu, TW;

Inventors:

Chin-Sung Liu, Hsinchu, TW;

Shin-Ter Tsai, Hsinchu, TW;

Tsung-Min Yang, Hsinchu, TW;

Tsung-Hung Wu, Hsinchu, TW;

Ming-Yan Lin, Hsinchu, TW;

Chi-Ling Chang, Hsinchu, TW;

Assignee:

TOPRAY MEMS INC., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/04 (2006.01);
U.S. Cl.
CPC ...
B23P 19/04 (2013.01);
Abstract

A method and structure for compensating tolerances in assembling modules are provided. The method applies to a pressing fixture and a module with a baseline reference plane and an assembly baseline plane. The assembly baseline plane has at least three compensation baseline bumps, having the height greater than the compensation amount. The pressing fixture has a calibration reference plane. The method comprises: adjusting the position of the module or the pressing fixture to make the baseline reference plane parallel to the calibration reference plane; the pressing fixture using the calibration reference plane to press on the compensation baseline bumps, and changing the position of bump top of each compensation baseline bump; removing the pressing fixture from the compensation baseline bumps, and the plurality of the bump tops forming a preliminary baseline plane, and the preliminary baseline plane being parallel to the baseline reference plane.


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