Company Filing History:
Years Active: 2007
Title: Tsung Hsien Lin: Innovator in Semiconductor Technology
Introduction
Tsung Hsien Lin is a prominent inventor based in Sun Chung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of via filling methods. His innovative approach has led to advancements that optimize manufacturing processes in the semiconductor industry.
Latest Patents
Tsung Hsien Lin holds a patent titled "Method of improving via filling uniformity in isolated and dense via-pattern regions." This patent describes an isotropic-diffusion filling method that employs a thermal process on a structure comprising a photoresist layer and an organic material layer. The method creates a cross-linking layer that minimizes step height differences between isolated and dense via-pattern regions. This innovation optimizes subsequent trench processes and simplifies overall manufacturing steps.
Career Highlights
Tsung Hsien Lin is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.
Collaborations
He has collaborated with notable colleagues, including Yung-Sung Yen and Kuei-Shun Chen, contributing to various projects that push the boundaries of semiconductor technology.
Conclusion
Tsung Hsien Lin's contributions to semiconductor technology through his innovative patent and collaborative efforts highlight his role as a key inventor in the industry. His work continues to influence advancements in manufacturing processes, showcasing the importance of innovation in technology.