Taichung, Taiwan

Tsung Han Chiang

This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung Han Chiang. Retrieved from https://idiyas.com/inventor/tsung-han-chiang-y87ffl0a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tsung Han Chiang and His Semiconductor Invention.

Introduction

Tsung Han Chiang is an inventor associated with Taichung, Taiwan, and Micron Technology Incorporated. His patent work concerns semiconductor device design, particularly the integration of metal pads and contact structures.

Latest Patents

Chiang is credited with 1 patent: “Integrated Circuit Device with Embedded Metal Pads.” The patent describes semiconductor devices and methods involving a metal pad whose lower side portion is embedded in dielectric material. A mask material covers portions of the dielectric surface, the pad’s upper side, and part of its top surface. A contact pillar is formed on another portion of the pad’s top surface and includes a metal pillar and a pillar bump.

Career Highlights

Chiang’s listed invention addresses the structure and arrangement of components in an integrated circuit device. His work is associated with Micron Technology Incorporated, a company active in semiconductor technology.

Collaborations

Chiang’s listed coworker is Shin Yueh Yang. Their shared association connects their work to semiconductor innovation at Micron Technology Incorporated.

Conclusion

Tsung Han Chiang’s patent on embedded metal pads reflects a focused contribution to integrated circuit device design, combining dielectric materials, metal pads, and contact pillars in a semiconductor structure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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