Company Filing History:

11 out of 381

Polyplastics Co., Ltd.

Hoechst Celanese Corporation

patents

Years Active: 1983-1996

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5484563 - Injection molding process using a resin reservoir containing a (1996-01-16),

2. 5091135 - Improvements in the encapsulation of electronic components employing low (1992-02-25),

3. 4803235 - Composition for injection molding (1989-02-07),

4. 4792587 - Resin composition which exhibits anisotropism when melted (1988-12-20),

5. 4777204 - Gear comprising fiber-reinforced anisotropic melt-forming polymer formed (1988-10-11),

6. 4772421 - Process for producing electroconductive resin composite (1988-09-20),

7. 4737398 - Metallic film with laminated layer of an anisotropic melt phase forming (1988-04-12),

8. 4726998 - Magnetic disk (1988-02-23),

9. 4719171 - Optical disc (1988-01-12),

10. 4717624 - Method of manufacturing a molded article having good dimensional (1988-01-05),

11. 4649172 - Polyacetal resin composition (1987-03-10),

12. 4626371 - Magnetic composite (1986-12-02),

13. 4622385 - Method of producing polyacetal polymer showing improved heat resistance (1986-11-11),

14. 4421888 - Sustained high arc resistant polyester composition (1983-12-20),

Title: The Innovative Mind of Tsuneyoshi Okada

Introduction

Tsuneyoshi Okada, an accomplished inventor based in Kawasaki, Japan, has significantly contributed to the field of materials engineering through his innovative inventions. With a remarkable portfolio of 14 patents, Okada's work primarily focuses on enhancing the processes and materials used in injection molding and the encapsulation of electronic components.

Latest Patents

Among Okada's latest inventions is a groundbreaking injection molding process utilizing a resin reservoir equipped with a retractable piston. This innovative method enhances the quality and strength of welds formed during the injection molding process by allowing for better migration of resin. Additionally, he developed an improved encapsulation technique for electronic components. This method employs a molten melt-processable polyester mixed with silicone oil or silicone rubber, ensuring high stability and protection for the encased components while minimizing damage under various environmental conditions.

Career Highlights

Okada's journey in the industrial sector has seen him work with notable companies including Polyplastics Co., Ltd. and Celanese GmbH. His experience in these organizations has enabled him to refine his skills and contribute to significant advancements in material science and technology.

Collaborations

Throughout his career, Okada has had the opportunity to collaborate with talented individuals such as Toshio Kanoe and Kenji Hijikata. These partnerships have facilitated knowledge exchange and fostered innovation, further emphasizing Okada's commitment to advancing the field of engineering.

Conclusion

Tsuneyoshi Okada stands out as a prolific inventor whose contributions have had a lasting impact on material processing technology. His continuous pursuit of innovation in injection molding and electronic component encapsulation not only showcases his creative ingenuity but also highlights his dedication to enhancing industry standards. Through his work, Okada not only protects the integrity of electronic components but also drives the success of manufacturing processes in modern engineering.

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