The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 1992
Filed:
Oct. 13, 1989
Tsuneyoshi Okada, Kawasaki, JP;
Toshikatsu Nitoh, Fuji, JP;
Toshio Kanoe, Osaka, JP;
Masato Togami, Fuji, JP;
Polyplastic Co., Ltd., Osaka, JP;
Abstract
An improved method for encapsulating an electronic component with a highly stable protective layer is provided. Such encapsulation is carried out by injection molding about the surface of the electronic component of an encapsulant composition comprising a molten melt-processable polyester which is capable of forming an anisotropic melt phase having uniformly blended therein about 0.1 to 30 percent by weight based upon the total weight of the composition of silicone oil and/or a silicone rubber. Quality encapsulation is made possible under conditions wherein damage to the electronic component is minimized, and the resulting product is well protected without damage under a wide variety of end use conditions including variations in temperature. The process is carried out in the substantial absence of deleterious mold shrinkage and the product exhibits an extremely low linear coefficient of thermal expansion which well protects the electronic component encased therein.