Location History:
- Fuji, JP (1986 - 1990)
- Osaka, JP (1992)
Company Filing History:
Years Active: 1986-1992
Title: Innovator Toshio Kanoe: Revolutionizing Electronic Component Encapsulation
Introduction
Toshio Kanoe, an influential inventor based in Fuji, Japan, has made a significant mark in the field of electronic components with his innovative inventions. With a remarkable portfolio of 17 patents, Kanoe's contributions have paved the way for enhancements in the encapsulation processes vital for electronic devices.
Latest Patents
Among his latest inventions, Toshio Kanoe has developed a sealing resin composition specifically designed for electronic components. This innovation involves a melt-processable polyester that possesses a weight-average molecular weight ranging from 1000 to 3900. This composition allows for the formation of an optically anisotropic molten phase and comprises up to 80 percent by weight of an inorganic powder treated with either an epoxysilane or mercaptosilane coupling agent. Additionally, he has introduced improvements in the encapsulation of electronic components using a highly stable protective layer achieved through an efficient injection molding process. The encapsulant composition, also based on melt-processable polyester, is combined with silicone oil and/or silicone rubber, ensuring the integrity and protection of electronic components under varied conditions.
Career Highlights
Toshio Kanoe’s career has been characterized by his commitment to enhancing electronic component protection. He has worked at Polyplastics Co., Ltd., where his expertise greatly contributed to the development of advanced materials and processes that foster innovation in the electronics industry.
Collaborations
Throughout his career, Kanoe has collaborated with notable colleagues such as Kenji Hijikata and Tsuneyoshi Okada. These partnerships reflect a shared vision in advancing technology and improving product reliability within the field of electronic components.
Conclusion
Toshio Kanoe's innovative spirit and prolific patent portfolio demonstrate his dedication to improving electronic component encapsulation methods. His work not only enhances product performance but also ensures longevity and stability under diverse operational conditions, solidifying his reputation as a significant inventor in the field.