Tsuneo Takeda

Title: Tsuneo Takeda: Innovator in Double Side Polishing Technology

Introduction

Tsuneo Takeda is a notable inventor from Souraku-gun, Japan, recognized for his contributions to the field of polishing technology. He holds a patent for a unique double side polishing method and apparatus, which enhances the efficiency and quality of polishing processes.

Latest Patents

Takeda's patent, titled "Double Side Polishing Method and Apparatus," introduces a technique that allows for the simultaneous polishing of both surfaces of multiple works. This innovative method involves rotating several carriers between upper and lower rotary surface plates. The design ensures that the workpieces are merged with the carriers outside the main body of the polishing apparatus. This allows for automatic supply of the workpieces onto the lower rotary surface plate, streamlining the polishing process. After the polishing is completed, the invention facilitates the automatic ejection of the workpieces from the lower rotary surface plate, significantly improving operational efficiency.

Career Highlights

Tsuneo Takeda is associated with Sumitomo Mitsubishi Silicon Corporation, where he has made significant contributions to the development of advanced polishing technologies. His work has been instrumental in enhancing the quality and efficiency of manufacturing processes in the semiconductor industry.

Collaborations

Throughout his career, Takeda has collaborated with esteemed colleagues, including Akira Horiguchi and Ken Isobe. These partnerships have fostered innovation and have contributed to the advancement of polishing technologies.

Conclusion

In summary, Tsuneo Takeda is a distinguished inventor whose work in double side polishing technology has made a significant impact in the industry. His innovative methods continue to influence the efficiency and quality of polishing processes in manufacturing.