Sumitomo Mitsubishi Silicon Corporation

Tsuneo Takeda

Akira Horiguchi

Ken Isobe

Hiroshi Matsumoto

Tomio Fukushima

Kiyohide Murata

Heigo Tanaka

Yoshiaki Uzu

To provide a technique for rotating a plurality of carriersbetween an upper and a lower rotary surface plates to simultaneously polish both surfaces of a plurality of works. The workis merged with the carrieroutside a polishing apparatus main body. The workis supplied onto a lower rotary surface plateof the polishing apparatus main bodywhile remaining merged with the carrier. The present invention enables the workon the lower rotary surface plateto be perfectly automatically supplied. After double side polishing has been completed and when an upper rotary surface plate, a liquid such as a water is injected from the upper rotary surface plate to hold the plurality of worksto have both surfaces thereof polished, on the lower rotary surface plate. The present invention enables the worksto be automatically ejected from the lower rotary surface plate. A brush housing sectionand a dresser housing sectionare provided near the polishing apparatus main body. Brushes and dressers are used to frequently efficiently process polishing clothes installed on opposite surfaces of the upper and lower rotary surface plates to efficiently and economically achieve high-quality double side polishing.

Double side polishing method and apparatus

Growing community of inventors

Souraku-gun, Japan

Tsuneo Takeda