Tsukasa Obinata

Title: Tsukasa Obinata: Innovator in Interconnection Substrates

Introduction

Tsukasa Obinata is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of interconnection substrates, showcasing his innovative spirit through his patented inventions. His work is particularly relevant in the realm of electronics, where interconnection substrates play a crucial role.

Latest Patents

Obinata holds a patent for an "Interconnection substrate and method of inspecting interconnection substrate." This invention features an interconnection substrate that includes a barcode, which is designed to enhance the functionality and inspection processes of electronic components. The substrate comprises a core layer, an interconnection layer, an insulating layer, and additional interconnection layers, all meticulously arranged to optimize performance.

Career Highlights

Throughout his career, Tsukasa Obinata has been associated with Shinko Electric Industries Co., Ltd. His work at this esteemed company has allowed him to collaborate with other talented professionals in the field. He has demonstrated a commitment to advancing technology through his innovative designs and solutions.

Collaborations

Obinata has worked alongside notable colleagues such as Yusuke Karasawa and Hideyuki Tako. Their collaborative efforts have contributed to the development of cutting-edge technologies in the electronics sector.

Conclusion

In summary, Tsukasa Obinata is a distinguished inventor whose work in interconnection substrates has made a significant impact on the electronics industry. His innovative patent reflects his dedication to enhancing technology and improving inspection methods.