The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Mar. 02, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Tsukasa Obinata, Nagano, JP;

Yusuke Karasawa, Nagano, JP;

Hideyuki Tako, Nagano, JP;

Goshi Imai, Nagano, JP;

Suguru Yamato, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G06K 19/06 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0266 (2013.01); G06K 19/06028 (2013.01); H05K 1/113 (2013.01); H05K 2201/10227 (2013.01);
Abstract

An interconnection substrate having a barcode includes a core layer, an interconnection layer over a first surface of the core layer, an insulating layer to cover the interconnection layer, and one or more additional interconnection layers over the insulating layer, wherein the barcode includes cells arranged at spaced intervals, and a cell pattern is made by forming penetrating holes through the core layer in some of the cells but not in remaining ones of the cells, wherein the penetrating holes are filled with resin, and an end face of the resin is exposed on the same side as the first surface such that the interconnection layer is situated in a surrounding area of the end face but not over the end face, and wherein a number of interconnection layers over the end face is smaller than a number of interconnection layers in the surrounding area of the end face.


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