Goshi Imai

Title: Goshi Imai: Innovator in Interconnection Substrates

Introduction

Goshi Imai is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of interconnection substrates, showcasing his expertise through innovative patents. His work is particularly recognized for its practical applications in electronic components.

Latest Patents

Goshi Imai holds a patent for an "Interconnection substrate and method of inspecting interconnection substrate." This invention features an interconnection substrate that includes a core layer, an interconnection layer over a first surface of the core layer, and an insulating layer that covers the interconnection layer. The substrate is designed with a barcode that consists of cells arranged at spaced intervals. A unique aspect of this patent is the formation of penetrating holes through the core layer in some cells, which are filled with resin. This design allows for effective inspection and enhances the functionality of the interconnection substrate.

Career Highlights

Goshi Imai is associated with Shinko Electric Industries Co., Ltd., where he has been instrumental in advancing technology related to interconnection substrates. His innovative approach has led to the development of solutions that improve the efficiency and reliability of electronic devices.

Collaborations

Goshi Imai has worked alongside talented colleagues such as Tsukasa Obinata and Yusuke Karasawa. Their collaborative efforts have contributed to the success of various projects within the company.

Conclusion

Goshi Imai's contributions to the field of interconnection substrates highlight his role as an influential inventor. His patent reflects a commitment to innovation and practical solutions in technology.