Kisarazu, Japan

Tsukasa Fukurai

This inventor holds 1 USPTO granted patent. Top assignees: Denso Corporation, Yoshikawa Kogyo Co., Ltd.. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsukasa Fukurai. Retrieved from https://idiyas.com/inventor/tsukasa-fukurai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Tsukasa Fukurai: Innovator in Electronic Device Manufacturing

Introduction

Tsukasa Fukurai is a notable inventor based in Kisarazu, Japan. He has made significant contributions to the field of electronic device manufacturing, particularly through his innovative methods.

Latest Patents

Fukurai holds a patent for a "Method for manufacturing electronic device including package." This patent outlines a process for creating an acceleration sensor device. The method involves preparing a lid for covering an opening of a package body through stamping. The lid is then plated, and plating films are formed on its surfaces. Any burrs created during the plating process are removed using chemical polishing. Finally, a semiconductor sensor chip is inserted into the package body through the opening and fixed in place before attaching the lid.

Career Highlights

Throughout his career, Tsukasa Fukurai has worked with prominent companies, including Denso Corporation and Yoshikawa Kogyo Co., Ltd. His experience in these organizations has contributed to his expertise in electronic device manufacturing.

Collaborations

Fukurai has collaborated with various professionals in his field, including his coworker Tomohito Kunda.

Conclusion

Tsukasa Fukurai's innovative methods in electronic device manufacturing have made a significant impact in the industry. His patent and career achievements reflect his dedication to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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