The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2008
Filed:
Sep. 16, 2004
Applicants:
Tomohito Kunda, Okazaki, JP;
Tsukasa Fukurai, Kisarazu, JP;
Inventors:
Tomohito Kunda, Okazaki, JP;
Tsukasa Fukurai, Kisarazu, JP;
Assignees:
DENSO CORPORATION, Kariya, JP;
Yoshikawa Kogyo Co., Ltd., Fukuoka-pref., JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a method for manufacturing an acceleration sensor device, a lid for covering an opening of a package body is prepared by stamping. The lid is plated and plating films are formed on surfaces of the lid. The burrs formed on the surfaces of the lid in the plating process are removed by chemical polishing. A semiconductor sensor chip is inserted in the package body through the opening and fixed. Then, the lid 70 is attached to the package body.