Kariya, Japan

Tsuguya Shimosakamoto

This inventor holds 1 USPTO granted patent. Top assignee: Denso Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsuguya Shimosakamoto. Retrieved from https://idiyas.com/inventor/tsuguya-shimosakamoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tsuguya Shimosakamoto: Innovator in Joined Assembly Technology

Introduction

Tsuguya Shimosakamoto is a notable inventor based in Kariya, Japan. He has made significant contributions to the field of joined assembly technology. His innovative approach has led to the development of a unique patent that enhances the efficiency and effectiveness of wire bundles in various applications.

Latest Patents

Shimosakamoto holds a patent for a "Joined assembly and production method thereof." This invention involves a joined assembly that comprises a wire bundle and a metallic member joined to the wire bundle. The wire bundle consists of multiple conductive wires that are isolated from each other using inter-wire insulating layers made from insulating resin. The design includes a head portion and a head extension, with the conductive wires being adhered together through the insulating layers and fusion-joined to the metallic member.

Career Highlights

Tsuguya Shimosakamoto is associated with Denso Corporation, a leading global automotive supplier. His work at Denso has allowed him to focus on innovative solutions that improve automotive technologies. His patent reflects his commitment to advancing engineering practices in the automotive industry.

Collaborations

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Conclusion

Tsuguya Shimosakamoto's contributions to joined assembly technology exemplify the spirit of innovation. His patent demonstrates the potential for improved designs in wire bundles, showcasing his expertise and dedication to advancing technology in the automotive sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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