The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Jan. 05, 2024
Denso Corporation, Kariya-city, JP;
Kazuki Koda, Kariya-city, JP;
Hideaki Shirai, Kariya-city, JP;
Tsuguya Shimosakamoto, Kariya-city, JP;
DENSO CORPORATION, Kariya-city, JP;
Abstract
A joined assembly comprises a wire bundle and a metallic member joined to the wire bundle. The wire bundle includes a bundle of a plurality of conductive wires which are isolated from each other using inter-wire insulating layers and adhered to each other, the inter-wire insulating layers being made from insulating resin. The wire bundle includes a head portion and a head extension. The head portion is arranged on a first side of the wire bundle in a lengthwise direction (Da) thereof. The head extension extends from the head portion to a second side of the wire bundle away from the first side in the lengthwise direction. The metallic member includes a metallic member connecting portion arranged in contact with the head extension. The conductive wires are kept adhered to each other through the inter-wire insulating layers in the head extension and fusion-joined in the head portion to a portion of the metallic member connecting portion. The head portion of the wire bundle has the inter-wire insulating layers removed therefrom.