Osaka, Japan

Tsuguo Inazawa

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsuguo Inazawa. Retrieved from https://idiyas.com/inventor/tsuguo-inazawa-wxl0r6mb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal1 out of 834,601 
Other
 patents

Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: The Innovations of Tsuguo Inazawa

Introduction

Tsuguo Inazawa is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of soldering technology, particularly with his innovative Pb-free soldering alloy. His work focuses on enhancing the mechanical strength and reliability of soldered connections in electronic devices.

Latest Patents

Inazawa holds a patent for a Pb-free soldering alloy that does not contain any lead (Pb). This innovative alloy is designed to prevent copper (Cu) from combining with nickel (Ni) in the soldering alloy at the soldered part. It effectively suppresses the generation of fine cracks and increases the mechanical strength of the soldered connections. The composition of the alloy includes 3.5 to 6.0 wt. % silver (Ag), 0.001 to 1.0 wt. % nickel (Ni), and tin (Sn) as the balance. He has 1 patent to his name.

Career Highlights

Inazawa's career is marked by his dedication to developing environmentally friendly soldering solutions. His work has been instrumental in advancing the electronics industry towards safer and more sustainable practices.

Collaborations

Inazawa has collaborated with notable colleagues such as Tadashi Sawamura and Fujio Nakagawa. Their combined expertise has contributed to the success of various projects in the field of soldering technology.

Conclusion

Tsuguo Inazawa's contributions to the development of Pb-free soldering alloys highlight his commitment to innovation and sustainability in electronics. His work not only enhances the performance of soldered connections but also promotes environmentally friendly practices in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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