The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2004
Filed:
Jun. 29, 2001
Applicant:
Inventors:
Tadashi Sawamura, Tokyo, JP;
Hisashi Komiya, Tokyo, JP;
Tsuguo Inazawa, Osaka, JP;
Fujio Nakagawa, Osaka, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 1/300 ; B23K 1/00 ;
U.S. Cl.
CPC ...
C22C 1/300 ; B23K 1/00 ;
Abstract
A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the soldering alloy, suppresses the generation of fine cracks at the soldered part and increases the mechanical strength of the soldered part. The Pb-free soldering alloy contains 3.5 to 6.0 wt. % Ag, 0.001 to 1.0 wt. % Ni and Sn for the balance.