Tsu-Wei Ku

Title: Tsu-Wei Ku: Innovator in Electronic Design Automation

Introduction

Tsu-Wei Ku is a prominent inventor based in Cupertino, CA, known for his contributions to the field of Electronic Design Automation (EDA). With a total of 4 patents, he has made significant advancements in chip design and layout optimization.

Latest Patents

One of his latest patents is titled "Chip-area reduction and congestion alleviation by timing-and-routability-driven empty-space propagation." This innovative EDA process focuses on collecting and relocating empty spaces among cells on a circuit layout to optimize chip size and alleviate routability congestion. The method involves globally moving empty spaces to target areas and refining their positions locally. Another notable patent is the "Method and apparatus of relative datapath cell placement with structure bonding." This invention outlines a relative structure placement of datapath cell instances, utilizing pseudo cells, pseudo pins, and pseudo nets to create desirable structures while minimizing net lengths. It also introduces a non-uniform partitioning of a density map for calculating force update vectors, enhancing the efficiency of cell instance placement.

Career Highlights

Tsu-Wei Ku has worked with several notable companies, including Arcadia Design Systems, Inc. and Hitachi Micro Systems, Inc. His experience in these organizations has contributed to his expertise in EDA and circuit design.

Collaborations

Throughout his career, Tsu-Wei Ku has collaborated with talented individuals such as Wei-Kong Chia and Dong-Ru Shieh, further enriching his work in the field.

Conclusion

Tsu-Wei Ku's innovative patents and career achievements highlight his significant impact on the Electronic Design Automation industry. His work continues to influence advancements in chip design and optimization.