Company Filing History:
Years Active: 1992-1996
Title: Tsing-Chow Wang: Innovator in Semiconductor Technology
Introduction
Tsing-Chow Wang is a notable inventor based in San Jose, CA, who has made significant contributions to the field of semiconductor technology. With a total of 4 patents to his name, Wang has developed innovative solutions that enhance the performance and reliability of semiconductor devices.
Latest Patents
Wang's latest patents include groundbreaking inventions such as "Bump formation on yielded semiconductor dies." This patent describes a ball bump structure that provides a hermetically sealed bond pad at the surface of a semiconductor chip. The invention features an adhesion pad that includes a barrier layer, preferably a titanium/tungsten alloy, and a bonding layer, such as a sputtered gold layer. A gold ball bump is formed on the adhesion pad, and methods for creating this improved structure are also disclosed.
Another significant patent is "Semi-conductor device interconnect package assembly for improved package." This invention presents a semiconductor device interconnect package assembly for TAB packages, which includes a central portion of material that offers scratch protection to the active surface of a semiconductor die and the inner lead bonding areas. The design allows for modifications to improve overall package performance and reduce stress generated due to thermal mismatch.
Career Highlights
Tsing-Chow Wang is currently employed at VLSI Technology, Inc., where he continues to innovate and contribute to advancements in semiconductor technology. His work has been instrumental in developing solutions that address critical challenges in the industry.
Collaborations
Wang has collaborated with notable colleagues, including Louis H. Liang and Serena M. Luo, who have also contributed to the field of semiconductor technology.
Conclusion
Tsing-Chow Wang's contributions to semiconductor technology through his patents and work at VLSI Technology, Inc. highlight his role as an influential inventor in the industry. His innovative solutions continue to shape the future of semiconductor devices.