The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 1992
Filed:
Dec. 20, 1991
Applicant:
Inventors:
Tsing-Chow Wang, San Jose, CA (US);
Louis H Liang, Los Altos, CA (US);
Assignee:
VLSI Technology, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437183 ; 437203 ; 437924 ; 437974 ;
Abstract
A process for fabricating conductive bumps on the bond pads of yielded good die includes forming a transparent structure upon which a masking layer is formed, aligning yielded good die and attaching them to the masking layer, and attaching a backing material to the backside of the die for mechanical support. The transparent structure is then removed and fabrication of the bumps continued on the bond pads of the good die by conventional means.