This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Tse-wei Liao: Innovator in Semiconductor Technology
Introduction
Tse-wei Liao is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor structure that enhances manufacturing processes.
Latest Patents
Tse-wei Liao holds a patent for a semiconductor structure with a daisy chain and a method of manufacturing the same. This semiconductor structure includes a first die surrounded by molding, a redistribution layer (RDL) beneath the first die, and a second die positioned under the RDL. The design features a plurality of first conductive pads and bumps that are electrically coupled, allowing for efficient connectivity and functionality.
Career Highlights
Liao's career is marked by his role at Taiwan Semiconductor Manufacturing Company Limited, where he has been instrumental in advancing semiconductor technologies. His expertise in the field has led to the successful implementation of innovative solutions that improve manufacturing efficiency.
Collaborations
Tse-wei Liao has collaborated with Chi-hui Lai, working together to push the boundaries of semiconductor technology. Their partnership has fostered an environment of innovation and creativity, leading to groundbreaking advancements in the industry.
Conclusion
Tse-wei Liao's contributions to semiconductor technology exemplify the spirit of innovation. His patent and collaborative efforts highlight the importance of teamwork in achieving technological advancements. His work continues to influence the semiconductor industry positively.