Toyokazu Shibata

Title: Toyokazu Shibata: Innovator in Semiconductor Technology

Introduction

Toyokazu Shibata is a prominent inventor based in Kawasaki, Kanagawa, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and compactness of semiconductor devices.

Latest Patents

One of Toyokazu Shibata's latest patents is a semiconductor device and method of manufacturing the same, aimed at reducing the package size of semiconductor devices. This invention includes a first die pad and a first inner lead arranged inside a molded resin, along with a second die pad and a second inner lead. The design allows for a part of the first inner lead and a part of the second inner lead to be adhered and electrically connected to each other. A first semiconductor chip mounted on the first die pad is electrically connected to a second semiconductor chip mounted on the second die pad via the first and second inner leads. Notably, an end face of one end of the first inner lead and the second inner lead that are adhered to each other is exposed to a side surface of the resin.

Career Highlights

Toyokazu Shibata is associated with Kabushiki Kaisha Toshiba, a leading company in the technology sector. His innovative work has contributed to advancements in semiconductor manufacturing processes and device design.

Collaborations

Throughout his career, Toyokazu has collaborated with notable colleagues, including Tomohiko Imada and Seiji Watanabe. These collaborations have further enhanced the development of cutting-edge semiconductor technologies.

Conclusion

Toyokazu Shibata's contributions to semiconductor technology exemplify his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.