The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Dec. 11, 2015
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;
Inventors:
Toyokazu Shibata, Kanagawa, JP;
Osamu Wada, Kanagawa, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); H05K 1/0201 (2013.01); H05K 1/181 (2013.01); H05K 2201/09036 (2013.01);
Abstract
According to one embodiment, there is provided a printed circuit board including a substrate having a trench between a first region and a second region. The first region is a region where a first package is to be mounted. The second region is a region where a second package is to be mounted. The trench has an opening portion in at least one of a first main surface and a second main surface of the substrate. The first main surface is a surface on which the first package is placed. The second main surface is positioned on reverse side of the first main surface of the substrate.