Tokyo, Japan

Toyokazu Ito

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 2.7

ph-index = 1


Company Filing History:


Years Active: 2020

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4 patents (USPTO):Explore Patents

Title: Toyokazu Ito: Innovator in Heat Conductive Technology

Introduction

Toyokazu Ito is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of heat conductive materials, holding a total of 4 patents. His work focuses on enhancing the efficiency of heat dissipation devices, which are crucial in various technological applications.

Latest Patents

Ito's latest patents include innovative designs for heat conductive sheets and methods of producing them. One of his notable inventions is a heat conductive sheet that incorporates a resin and a particulate carbon material. This sheet boasts a thermal resistance value under a pressure of 0.05 MPa of 0.20°C/W or less. Additionally, he has developed a heat dissipation device that utilizes this heat conductive sheet, effectively interposing it between a heat source and a heat radiator. Another patent features a heat conductive sheet with an Asker C hardness at 25°C of 60 or more, also achieving a thermal resistance value under a pressure of 0.5 MPa of 0.20°C/W or less.

Career Highlights

Toyokazu Ito is currently employed at Zeon Corporation, where he continues to innovate in the field of heat management technologies. His work has been instrumental in advancing the performance of electronic devices and other applications that require efficient heat dissipation.

Collaborations

Throughout his career, Ito has collaborated with notable colleagues, including Hiromi Kitagawa and Gen Kobayashi. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Toyokazu Ito's contributions to heat conductive technology exemplify his dedication to innovation. His patents not only enhance the efficiency of heat dissipation devices but also pave the way for future advancements in the field.

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