The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Feb. 17, 2017
Applicant:
Zeon Corporation, Chiyoda-ku Tokyo, JP;
Inventors:
Assignee:
ZEON CORPORATION, Chiyoda-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 27/12 (2006.01); C08K 3/04 (2006.01); C08L 27/14 (2006.01); C08L 27/16 (2006.01); C08L 27/18 (2006.01); C08L 27/20 (2006.01); C09K 5/14 (2006.01); C08J 5/18 (2006.01); H05K 7/20 (2006.01); H01L 23/36 (2006.01); C01B 32/152 (2017.01); C01B 32/205 (2017.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); C08K 7/06 (2006.01); F28F 21/02 (2006.01); F28F 21/06 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 37/182 (2013.01); B32B 38/0004 (2013.01); C01B 32/152 (2017.08); C01B 32/205 (2017.08); C08J 5/18 (2013.01); C08K 3/04 (2013.01); C08K 7/06 (2013.01); F28F 21/02 (2013.01); F28F 21/065 (2013.01); H01L 23/36 (2013.01); H05K 7/20 (2013.01); H05K 7/2039 (2013.01); B32B 2457/00 (2013.01); C08J 2319/00 (2013.01); C08J 2419/00 (2013.01); C08K 3/041 (2017.05); C08K 3/046 (2017.05); C08K 2201/001 (2013.01); C08L 27/12 (2013.01); C08L 27/14 (2013.01); C08L 27/16 (2013.01); C08L 27/18 (2013.01); C08L 27/20 (2013.01); C08L 2205/02 (2013.01); C08L 2205/025 (2013.01); C08L 2666/55 (2013.01);
Abstract
Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having an Asker C hardness at 25° C. of 60 or more and a thermal resistance value under a pressure of 0.5 MPa of 0.20° C./W or less, a method of producing a heat conductive sheet, and a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator.