The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Feb. 17, 2017
Applicant:
Zeon Corporation, Chiyoda-ku, Tokyo, JP;
Inventors:
Assignee:
ZEON CORPORATION, Chiyoda-ku Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 27/12 (2006.01); C08K 3/04 (2006.01); H01L 23/373 (2006.01); H01L 23/36 (2006.01); B32B 27/08 (2006.01); H05K 7/20 (2006.01); C08L 101/00 (2006.01); H01L 23/367 (2006.01); C08L 27/16 (2006.01); C08L 27/18 (2006.01); C08L 27/14 (2006.01); C08L 27/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); B32B 27/08 (2013.01); C08K 3/04 (2013.01); C08K 3/041 (2017.05); C08L 101/00 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/373 (2013.01); H05K 7/20 (2013.01); H05K 7/20481 (2013.01); C08K 3/046 (2017.05); C08L 27/12 (2013.01); C08L 27/14 (2013.01); C08L 27/16 (2013.01); C08L 27/18 (2013.01); C08L 27/20 (2013.01); C08L 2205/02 (2013.01); C08L 2205/025 (2013.01); C08L 2666/55 (2013.01);
Abstract
Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having a thermal resistance value under a pressure of 0.05 MPa of 0.20° C./W or less, a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator, and a method of producing a heat conductive sheet.