This inventor holds 1 USPTO granted patent. Top assignee: Ebara Corporation. Active years: 1996.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1996
Title: Innovations of Toshiyuki Koya
Introduction
Toshiyuki Koya is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of heat transfer materials, particularly in the development of efficient heating units. His innovative approach has led to advancements that enhance thermal efficiency and response times in heating applications.
Latest Patents
Toshiyuki Koya holds a patent for a heat transfer material designed for heating units. This patent describes a heat transfer material that consists of a substrate and an electrical insulating layer as the first layer, an electrically conductive layer as the second layer, and a heat insulating layer as the third layer. This unique combination allows for effective insulation of the substance being heated while ensuring high thermal efficiency and rapid thermal response.
Career Highlights
Koya is currently associated with Ebara Corporation, where he continues to innovate in the field of thermal technologies. His work has been instrumental in developing solutions that meet the growing demands for energy efficiency in heating systems.
Collaborations
Throughout his career, Toshiyuki Koya has collaborated with esteemed colleagues such as Syuichi Ueno and Tadamasa Hayashi. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Toshiyuki Koya's contributions to the field of heat transfer materials exemplify the importance of innovation in enhancing energy efficiency. His work continues to influence the development of advanced heating technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
