Tokyo, Japan

Toshiro Okubo

This inventor holds 5 USPTO granted patents and 1 published patent application. Top assignee: Tdk Corporation. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshiro Okubo. Retrieved from https://idiyas.com/inventor/toshiro-okubo-drm42e8d

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 80.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2018-2026

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5 patents (USPTO):Explore Patents

Title: Toshiro Okubo: Innovator in Electronic Circuit Packaging

Introduction

Toshiro Okubo is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electronic circuit packaging, holding a total of four patents. His innovative designs have advanced the technology used in electronic components, making them more efficient and effective.

Latest Patents

Okubo's latest patents include two notable electronic circuit packages. The first patent describes an electronic circuit package that features a substrate with a power supply pattern. It includes a first electronic component mounted on the front surface of the substrate, which is covered by a mold resin that embeds the component. Additionally, a laminated film, consisting of a magnetic film and a first metal film, covers the upper surface of the mold resin, with the first metal film connected to the power supply pattern. The magnetic film is selectively thick on the first region, enhancing the package's functionality.

The second patent also focuses on an electronic circuit package, which similarly includes a substrate with a power supply pattern and a first electronic component. This design features a mold resin that covers the substrate and has a concave portion above the first region. A magnetic film is selectively provided in this concave portion, while a first metal film, connected to the power supply pattern, covers the mold resin. These innovations reflect Okubo's commitment to improving electronic circuit design.

Career Highlights

Toshiro Okubo has built a successful career at TDK Corporation, where he has been instrumental in developing cutting-edge electronic solutions. His work has not only contributed to the company's reputation but has also influenced the broader electronics industry.

Collaborations

Throughout his career, Okubo has collaborated with talented individuals such as Kenichi Kawabata and Toshio Hayakawa. These partnerships have fostered a creative environment that has led to the development of innovative technologies.

Conclusion

Toshiro Okubo's contributions to electronic circuit packaging demonstrate his expertise and dedication to innovation. His patents reflect a deep understanding of technology and a commitment to advancing the field. His work continues to impact the electronics industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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