The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Mar. 21, 2017
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/32051 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/97 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract
Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a laminated structure of a magnetic film and a metal film, the laminated structure covering at least an upper surface of the molding resin. The metal film is connected to the power supply pattern, and a resistance value at an interface between the magnetic film and the metal film is equal to or larger than 10Ω.