Ogaki, Japan

Toshio Nishiwaki

This inventor holds 3 USPTO granted patents. Top assignee: Ibiden Company Limited. Active years: 2014-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshio Nishiwaki. Retrieved from https://idiyas.com/inventor/toshio-nishiwaki

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014-2016

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3 patents (USPTO):Explore Patents

Title: Innovations of Toshio Nishiwaki

Introduction

Toshio Nishiwaki is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring boards, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of electronic components.

Latest Patents

Nishiwaki's latest patents include innovative designs for printed wiring boards. One of his patents describes a printed wiring board that features a core insulation layer with a via conductor, a first conductive layer made of copper foil and a plated film, and an interlayer insulation layer. This design ensures that the dielectric constants of the core and interlayer layers are 4.0 or lower for signal transmission at a frequency of 1 GHz. Additionally, the thermal expansion coefficient is maintained at 85 ppm/°C or lower at or below Tg, with the first layer's foil thickness being greater than that of the second layer.

Another patent outlines a printed wiring board that includes a core insulation layer with via conductors and two structures with interlayer insulation layers on both surfaces of the core layer. The interlayer layers are designed to have dielectric constants of 4.0 or lower for effective signal transmission. The core layer's thermal expansion coefficient is set to be lower than that of the interlayer layers, ensuring optimal performance.

Career Highlights

Toshio Nishiwaki is currently employed at Ibiden Company Limited, where he continues to innovate in the field of electronic components. His work has been instrumental in advancing the technology behind printed wiring boards, making them more efficient and reliable for various applications.

Collaborations

Nishiwaki collaborates with Tetsuo Amano, a fellow innovator in the field. Their combined expertise contributes to the development of cutting-edge technologies in printed wiring boards.

Conclusion

Toshio Nishiwaki's contributions to the field of printed wiring boards demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the technical requirements for modern electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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