Toshimasa Sugimura

Title: The Innovations of Toshimasa Sugimura

Introduction

Toshimasa Sugimura is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

One of his latest patents is a dicing tape-integrated film for semiconductor back surfaces. This invention provides a film designed for flip chip type semiconductor back surfaces, which protects the back surface of a semiconductor element that is flip chip-connected to an adherend. The dicing tape includes a base material and a pressure-sensitive adhesive layer, with the film being formed on the adhesive layer. Notably, the pressure-sensitive adhesive layer is a radiation-curable type, whose adhesive force is reduced by irradiation with a radiation ray.

Career Highlights

Toshimasa Sugimura is currently employed at Nitto Denko Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced materials that improve the reliability and performance of semiconductor devices.

Collaborations

He has collaborated with notable coworkers, including Naohide Takamoto and Goji Shiga, contributing to a dynamic team focused on cutting-edge research and development.

Conclusion

Toshimasa Sugimura's contributions to semiconductor technology through his innovative patents and collaborative efforts highlight his importance in the field. His work continues to influence advancements in semiconductor manufacturing processes.