Nitto-denko Corporation

Toshimasa Sugimura

Naohide Takamoto

Goji Shiga

Fumiteru Asai

Minoru Miyatake

Hiroyuki Yoshimi

Takeharu Kitagawa

Hiroaki Mizushima

The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.

Dicing tape-integrated film for semiconductor back surface

A polarizing plate of the present invention includes a stretched laminate that is a laminate including a base material layer and a hydrophilic polymer layer and has undergone a stretching process, and at least a dichroic substance is adsorbed to the hydrophilic polymer layer. The polarizing plate of the present invention can be prevented from curling even when the polarizer is reduced in thickness.

Polarizing plate, optical film and image display

Growing community of inventors

Osaka, Japan

Toshimasa Sugimura