Yokohama, Japan

Toshiki Miyakawa

This inventor holds 17 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Illumination Technology. Top assignees: Canon Kabushiki Kaisha, Ebara Corporation. Active years: 2014-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshiki Miyakawa. Retrieved from https://idiyas.com/inventor/toshiki-miyakawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 82.4


Average Co-Inventor Count = 2.1

ph-index = 3

Forward Citations = 29(Granted Patents)


Location History:

  • Yokohama, JP (2014 - 2021)
  • Tokyo, JP (2017 - 2024)

Company Filing History:


Years Active: 2014-2025

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Areas of Expertise:
Polishing Apparatus
Illumination Device
Lighting Device
Plating Method
Image Capturing
Optical Accessories
Camera System
Film Thickness Distribution
Substrate Holder
Resistance Measuring
Imaging Apparatus
Light Emission Control
17 patents (USPTO):Explore Patents

Title: **Innovator Toshiki Miyakawa: Pioneering Advancements in Polishing Technology**

Introduction

Toshiki Miyakawa, an accomplished inventor based in Tokyo, Japan, has made significant contributions to the field of polishing technology. With a total of four patents to his name, his innovations are paving the way for enhanced precision and efficiency in various industrial applications.

Latest Patents

Miyakawa's latest patents include a sophisticated polishing apparatus and method designed to prevent condensation on the inner surface of a transparent window in a polishing pad. This innovation allows for accurate measurement of film thickness, a critical factor in many manufacturing processes. The apparatus comprises a polishing pad with a polished surface, a polishing head that presses a workpiece against the pad, a transparent window, and an optical sensor head that directs light to the workpiece for measurement. A cooling device further enhances performance by cooling the space between the optical sensor and the transparent window.

Another of his notable patents introduces a polishing apparatus capable of accurately acquiring film thickness distribution information. This system utilizes a polishing table, multiple film thickness sensors, and a controller that analyzes the film thickness distribution while also identifying key positions on the substrate.

Career Highlights

Toshiki Miyakawa is currently employed by Ebara Corporation, a leading provider in the field of environmental engineering and advanced semiconductor manufacturing equipment. His role at Ebara has allowed him to focus intensely on polishing technologies, leading innovations that directly impact efficiency and precision in the semiconductor industry.

Collaborations

Throughout his career, Miyakawa has collaborated with esteemed colleagues, including Masashi Shimoyama and Takashi Kishi. Their shared expertise has fostered an environment of innovation, further driving advancements in polishing methodologies.

Conclusion

Through his innovative spirit and dedication to improving polishing technology, Toshiki Miyakawa stands out as a key figure in his field. His contributions will undoubtedly continue to influence and inspire future advancements in various industrial applications, solidifying his status as a prominent inventor in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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