Toshikazu Imai

Title: Toshikazu Imai: Innovator in Bonded SOI Wafer Technology

Introduction

Toshikazu Imai is a notable inventor based in Chikuma, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the manufacturing of bonded silicon-on-insulator (SOI) wafers. His innovative methods have enhanced the performance characteristics of these essential components in modern electronics.

Latest Patents

Imai holds a patent for a "Method for manufacturing bonded SOI wafer and bonded SOI wafer." This method utilizes a silicon single crystal wafer with a resistivity of 100 Ω·cm or more as the base wafer. The process involves several steps, including forming an underlying insulator film on the bonding surface of the base wafer, depositing a polycrystalline silicon layer, and performing ion implantation to create a modified silicon layer. The final steps include bonding the wafers with an insulator film in between and thinning the bonded wafer to form an SOI layer. This innovative approach results in a bonded SOI wafer that exhibits excellent harmonic wave characteristics.

Career Highlights

Toshikazu Imai is associated with Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His work has been instrumental in advancing the technology behind SOI wafers, which are crucial for various electronic applications. His patent reflects his commitment to improving the efficiency and performance of semiconductor devices.

Collaborations

Imai has collaborated with notable colleagues, including Kazuhiko Yoshida and Miho Niitani. These partnerships have contributed to the development of innovative solutions in the semiconductor field.

Conclusion

Toshikazu Imai's contributions to the manufacturing of bonded SOI wafers highlight his role as a key innovator in semiconductor technology. His patented methods not only enhance the performance of electronic components but also pave the way for future advancements in the industry.