Company Filing History:
3 out of 83 
2 out of 15 
Years Active: 2020-2023
Title: Toshiichi Sawaguchi: Innovator in Thermal Conductivity
Introduction
Toshiichi Sawaguchi is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of thermal conductivity through his innovative patents. With a total of three patents to his name, Sawaguchi's work focuses on enhancing the performance and reliability of thermal insulating materials.
Latest Patents
Among his latest patents are a thermally conductive insulating sheet and a composite member. The thermally conductive insulating sheet is designed to have appropriate fluidity when heated and pressurized, ensuring that it remains free from material leakage beyond its original size. This invention incorporates an uncured or semi-cured binder resin, which is a thermosetting resin. The complex viscosity of this material ranges from 10,000 to 150,000 Pa·s within a temperature range of 100-200°C, with a flow value of 90-100%.
The composite member patent outlines specific criteria for its performance, including shear bond strength and linear expansion coefficients of various materials involved. These innovations are crucial for applications requiring efficient heat dissipation and stability under varying thermal conditions.
Career Highlights
Toshiichi Sawaguchi has worked with prominent companies such as Toyo Ink SC Holdings Co., Ltd. and Toyochem Co., Ltd. His experience in these organizations has allowed him to refine his expertise in thermal materials and contribute to advancements in the industry.
Collaborations
Throughout his career, Sawaguchi has collaborated with talented individuals, including Naohiro Tanaka and Kaori Sakaguchi. These partnerships have fostered a creative environment that has led to the development of his innovative patents.
Conclusion
Toshiichi Sawaguchi's contributions to thermal conductivity through his patents demonstrate his commitment to innovation in material science. His work continues to influence the industry and pave the way for future advancements in thermal management solutions.