The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Aug. 13, 2018
Toyo Ink SC Holdings Co., Ltd., Tokyo, JP;
Toyochem Co., Ltd., Tokyo, JP;
Toshiichi Sawaguchi, Tokyo, JP;
Naohiro Tanaka, Tokyo, JP;
Kaori Sakaguchi, Tokyo, JP;
Kenji Andou, Tokyo, JP;
Hidenobu Kobayashi, Tokyo, JP;
TOYO INK SC HOLDINGS CO., LTD., Tokyo, JP;
TOYOCHEM CO., LTD., Tokyo, JP;
Abstract
A composite member (1) satisfies the following expressions. X/(E×|CTE(B)−CTE(A)|)≥50, X/(E×|CTE(B)−CTE(C)|)≥50, Y/|CTE(B)−CTE(A)|×L(BA)≤50, and Y/|CTE(B)−CTE(C)|×L(BC)≥50. X: shear bond strength (MPa) between the heat dissipating base substrate and heat generating member, Y: fracture elongation of the thermoconductive insulating adhesive film, E: modulus of elasticity (MPa) of the thermoconductive insulating adhesive film, CTE(A): linear expansion coefficient (° C.) of the heat dissipating base substrate, CTE(B): linear expansion coefficient (° C.) of the thermoconductive insulating adhesive film, CTE(C): linear expansion coefficient (° C.) of the material of the surface of the heat generating member in contact with the thermoconductive insulating adhesive film, L(BA): initial contact length (m) between the thermoconductive insulating adhesive film and the heat dissipating base substrate, and L(BC): initial contact length (m) between the thermoconductive insulating adhesive film and the heat generating member.