Tokyo, Japan

Kenji Andou


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2022-2023

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2 patents (USPTO):Explore Patents

Title: Kenji Andou: Innovator in Thermal Conductivity

Introduction

Kenji Andou is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of thermal conductivity through his innovative patents. With a total of two patents to his name, Andou's work focuses on enhancing the efficiency and reliability of thermal insulating materials.

Latest Patents

Andou's latest patents include a thermally conductive insulating sheet and a composite member. The thermally conductive insulating sheet is designed to have appropriate fluidity when heated and pressurized, ensuring that there is no leakage of material beyond the original size of the sheet. This invention incorporates an uncured or semi-cured binder resin, which is a thermosetting resin. The complex viscosity of this material ranges from 10,000 to 150,000 Pa·s at temperatures between 100-200°C, with a flow value of 90-100%.

The composite member patent outlines specific expressions that must be satisfied, focusing on shear bond strength and linear expansion coefficients. These parameters ensure that the composite member maintains its integrity and performance under varying conditions.

Career Highlights

Throughout his career, Kenji Andou has worked with prominent companies such as Toyo Ink SC Holdings Co., Ltd. and Toyochem Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in thermal materials.

Collaborations

Andou has collaborated with notable colleagues, including Toshiichi Sawaguchi and Naohiro Tanaka. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Kenji Andou's contributions to thermal conductivity through his patents demonstrate his commitment to innovation in material science. His work continues to influence the industry and pave the way for future advancements.

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