Company Filing History:
Years Active: 1989-1995
Title: Toshiaki Ichinose: Innovator in Soldering and Thin Film Technology
Introduction
Toshiaki Ichinose is a notable inventor based in Yokohama, Japan, recognized for his contributions to solder inspection methods and thin film multilayer substrate production. With a total of four patents to his name, Ichinose continues to push the boundaries of innovation in the electronic manufacturing field.
Latest Patents
Among his latest patents, Toshiaki Ichinose has developed an "Inspection method for soldered joints using X-ray imaging and apparatus." This advanced method employs X-ray technology to inspect soldered joints formed by soldering a lead to a substrate surface. The method meticulously involves moving and rotating the substrate to position the soldered joint optimally while maintaining a desired oblique irradiation angle of the X-ray. As a result, the transmitted X-ray data can provide insights into the condition of the soldered joint based on output signals from the detector.
Ichinose's other significant invention is the "Method for producing thin film multilayer substrate." This method enhances production yield for large-size thin film multilayer substrates essential for mounting LSI chips. It encompasses steps such as optically detecting the uppermost conductor pattern layer, inspecting for faults, and repairing any issues detected based on detailed fault position data.
Career Highlights
Toshiaki Ichinose has made considerable strides in his career while working at Hitachi, Ltd., a leading company in technology and innovation. His patents reflect his dedication to improving manufacturing processes and electronic component production.
Collaborations
Ichinose collaborates closely with fellow innovators Takanori Ninomiya and Yasuo Nakagawa, reinforcing a culture of teamwork and shared knowledge at Hitachi, Ltd. Their collective efforts in research and development have proven beneficial in advancing technology within the company.
Conclusion
In conclusion, Toshiaki Ichinose stands out as a prominent inventor in Yokohama, Japan, with his groundbreaking patents in solder inspection and substrate production. His innovative methods continue to foster advancements in the electronic manufacturing industry, setting new standards for quality and efficiency.